Geo Week News

November 27, 2017

NewSight and LeiShen join the automotive market with the V-LiDAR

LiDAR Road Scan

The race for the most reliable and efficient lidar sensor for autonomous cars is still ongoing. That’s why NewSight and LeiShen have partnered to deliver the V-LiDAR.

Founded in 2016, NewSight Imaging focuses on the development of advanced CMOS image sensor chips for use in two main market segments: machine vision (with applications including lidar for drones, automotive visual safety solutions, and autonomous home appliance robots) and spectral analysis (with applications including portable food inspection and medical devices). NewSight’s machine vision technology combines both digital and analog processing units, which they results in a CMOS chip with high performance, accuracy, resolution, sensitivity, rechargeability, and portability.

LeiShen Intelligent produces lidar products for robot navigation and anti-collision, laser imaging, obstacle-avoidance for self-driving vehicles, and more. The company has been awarded 37 domestic and overseas patents, 16 software copyrights, and claims to be the first manufacturer to develop an ASIC chip for time of flight lidar.

The product of this partnership is the V-LiDAR, a 3D pulse-based LiDAR designed for automotive applications used in advanced driver assistance systems and in autonomous vehicles.

The V-LiDAR is a solid-state, high resolution (VGA and above) and ISO-certified sensor. It uses NewSight’s patent-pending eTOF (enhanced time of flight) system, which the company says extends the technology’s dynamic range to reach the 200 m distance required for automotive applications. The sensor was designed in collaboration with Tier-1 and Automotive OEMs.

Additionally, both companies will work directly with first adopters, OEM, and first-tier collaborators through a collaboration program. This program will provide access to R&D in order to define, review, and contribute to the product definition, influencing the lidars’s internals, such as CMOS image sensor, optics, board, software algorithms, and interfaces. Companies who develop advanced state-of-the-art support solutions are also welcome to be part of this collaboration program.

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