Vayyar and SoftBank Corp. bring together 3D sensing, IoT, AI


In a press release that names nearly every hot technology but blockchain, Vayyar Imaging and SoftBank have announced a collaboration to develop innovative IoT technology.

Vayyar’s part of the collaboration will be to supply 3D sensing know-how by drawing on its experience in radio wave 3D imaging, which is notable for its ability to “see” through various materials to capture obscured objects. For instance, the sensor can be used to scan a run of pipe that has been obscured by a wall.

Japanese company SoftBank Corp., which has its hands in a broad range of technologies like smart robotics, FinTech, and cloud security, will offer expertise in internet of things (IoT) and artificial intelligence (AI).

Together, the two companies will develop applications that use 3D radio wave sensing, IoT, and AI in public transport, construction, and elderly care. They have named specific applications that include analyzing people flow for use in transportation optimization, monitoring structural integrity in real time during and after construction, providing safety solutions for public areas, and collecting and analyzing big data.


About Author

SPAR 3D Editor Sean Higgins produces SPAR 3D's weekly newsletters for 3D-scanning professionals, and Sean has previously worked as a technical writer, a researcher, a freelance technology writer, and an editor for various arts publications. He has degrees from Hampshire College in Amherst, Massachusetts and the University of Aberdeen in Scotland, where he studied the history of sound-recording technologies. Sean is a native of Maine and lives in Portland.

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